Open Access Journal

ISSN : 2456-1304 (Online)

International Journal of Engineering Research in Electronics and Communication Engineering(IJERECE)

Monthly Journal for Electronics and Communication Engineering

Open Access Journal

International Journal of Science Engineering and Management (IJSEM)

Monthly Journal for Science Engineering and Management

ISSN : 2456-1304 (Online)

Stress Reduction and Lifespan Improvement in Cold Forging Marking Dies: A Comparative Study

Author : Afshin Zohdi, Mesut Çiftçi, Yunus Emre Uyanık

Date of Publication :8th October 2024

Abstract:This study investigates the performance and longevity of four different marking die designs (MD1, MD2, MD3, and MD4) used in the cold forging process for bolt production. The equivalent stress levels and life spans (production amounts) of the dies were analyzed using both simulation and experimental validation. The results indicate a significant variation in stress levels and li fe spans among the different designs. MD1 exhibited the highest maximum equivalent stress at 12068.5 MPa and the shortest life span with a production amount of 279,422 parts. In contrast, MD4 showed the lowest maximum equivalent stress at 4983.56 MPa and the longest life span with a production amount of 752,520 parts. These findings demonstrate that MD4's life span is approximately 2.69 times greater than that of MD1, while the stress level in MD1 is about 2.42 times higher than in MD4. The serrated design of MD2 and the non-intersecting serrated design of MD3 resulted in maximum equivalent stresses of 5885.89 MPa and 6308.73 MPa, with production amounts of 562,740 and 454,080 parts, respectively. These results confirm that incorporating serrations and reducing the numb er of sharp corners in the die design can significantly enhance the stress distribution and extend the die's operational life.

Reference :

Will Updated soon

Recent Article